2018 Engis EVG-300 Vertical Grinding Machine

The Engis EVG-300 is a high-precision vertical grinding and lapping machine manufactured by the Engis Corporation Japan. It is designed for ultra-precision back-thinning, grinding, and polishing of hard, brittle materials like silicon carbide (SiC), sapphire, and ceramics used in the semiconductor and MEMS industries.

Key Specifications & Features

• Machine Dimensions: 1050 × 1050 × 2020 mm
• Grinding Spindle Motor: Typically 9 kW, 3-phase, 220V/60Hz
• Speed Capabilities: Worktable speed of up to 400 rpm; wheel speed of up to 2000 rpm [1, 2]
• Advanced Controls: Equipped with a Programmable Logic Controller (PLC) with available upgrades for automatic wheel dressing, automated positioning, and continuous in-process thickness measurement. [1]
• Wheel Technology: Can utilize Engis' proprietary MAD (Mixed Abrasive Diamond) and Hy-Grind vitrified grinding wheels to achieve surface roughness below 1 nm Ra. [1, 2, 3, 4]

Ideal Applications

• Wafer back-thinning (SiC, Si, GaAs, GaN, and InP)
• Processing semiconductor components like ceramic chucks and glass ceramics
• Substrate machining for advanced packaging and MEMS