Perkin Elmer 4451 for Rf, DC, Pulsed DC sputtering, (3) Delta Cathodes, CTI Cryo- Refurbished

The Perkin Elmer 4451 (Sputtertech STI-4451) is a high-vacuum thin-film deposition system built on the architecture of the legendary Perkin-Elmer 4400 series sputtering equipment.

Configuration:

Advanced Energy Pinnacle DC power supply for DC sputtering

Advanced Energy Dressler Rf power supply for Rf sputtering

CTI 8 cryopump for main chamber. Pfeiffer turbo pump for loadlock

Core System Features

• Architecture: Fast-cycle, load-locked deposition chamber system that allows you to load/unload substrates without venting the main vacuum chamber.
• Deposition Modes: Supports DC, RF Sputtering, and Co-sputtering.
• Substrate Handling: Includes motorized, water-cooled rotating tables used for wafers and complex substrates up to 8 inches in diameter.
• Base Vacuum: High vacuum cryopump typically achieving below (2 x10-6 Torr). Load lock uses a separate turbo pump
• Pump Down Time: Pulling down to the required high vacuum takes approximately 2.5 hours using a combination of mechanical roughing, foreline, and cryo pump
• Target Materials: Utilizes circular delta cathodes (typically 8-inch) to efficiently eject target particles onto substrates for thin-film coating. Configuration and Specification of Perkin-Elmer 4451 UHV sputtering system:
• Basic System PC with Sputtertech software
• New Power Distribution Box: AC380V /208V/ 3Phase
• Fully Refurbished Perkin-Elmer Original Frame
• Fully Refurbished parts replaced with new as necessary
• Fully Refurbished Process Chamber
• Fully Refurbished Load lock
• Fully Refurbished Vacuum Systems for load lock and process chamber

Cathode Shape: Delta

Delta Cathodes: 1 to 3

Throughput per Batch 3” wafer, 30 pieces ; 4”wafer, 13 pieces; 5” wafer, 9 pieces; 6” wafer,7 pieces; 8’ wafer, 5 pieces

Sputter Rate: 20 to 500 Angstroms/kw-min depending on different model, cathode, process, sputter material etc

Uniformity Capacity ±5%~7%Options*