Perkin Elmer 4451 for Rf, DC, Pulsed DC sputtering, (3) Delta Cathodes, CTI Cryo

The Perkin Elmer 4451 (Sputtertech STI-4451) is a high-vacuum thin-film deposition system built on the architecture of the legendary Perkin-Elmer 4400 series sputtering equipment.

Configuration:

Advanced Energy Pinnacle DC power supply for DC sputtering

Advanced Energy Dressler Rf power supply for Rf sputteering.

CTI 8 cryopump for main chamber. Pfeiffer turbo pump for loadlock.

Completely rebuilt and upgraded by SputterTech.

Core System Features

• Architecture: Fast-cycle, load-locked deposition chamber system that allows you to load/unload substrates without venting the main vacuum chamber.
• Deposition Modes: Supports DC, RF Sputtering, and Co-sputtering.
• Substrate Handling: Includes motorized, water-cooled rotating tables often used for wafers and complex substrates up to 6 inches in diameter.

Operation and Maintenance

• Base Vacuum: High vacuum cryopump typically achieving below (2 x10-6 Torr). Load lock uses a separate turbo pump
• Pump Down Time: Pulling down to the required high vacuum takes approximately 2.5 hours using a combination of mechanical roughing, foreline, and cryo pump
• Target Materials: Utilizes circular oe delta cathodes (typically 8-inch) to efficiently eject target particles onto substrates for thin-film coating.

While originally manufactured in the 1990s, these systems are considered workhorses in R&D and pilot production environments. Because the original PLCs and control systems are largely obsolete, many operational units rely on modern hardware and software upgrades