Tepla 600-AL (autoload) plasma asher for 200mm wafers with ENI 13.56mHz Rf generator

TEPLA 600 PLASMA ASHER consisting of:
 
- Model: 600 SemiAuto
- Semi-Automatic RF Plasma System 
- Can process up to 200mm wafers
- Used for photoresist stripping and surface cleaning, as well as etching silicon and its compounds
- Chamber Size: 245mm diameter, 380mm depth
- Chamber Material: ceramic
- ENI RF Generator: 0-600 Watt, 13.56 MHz
- Gases: 4 channels controlled by 4 MFCs 
- Leybold D65B Vacuum Pump
- Dimensions: 740mm x 624mm x 701mm + connections
- Electrical: 230V, 50/60Hz, 15A, 2kW
- sn 1656
- 1731 hours

 
The Tepla 600 Semi-Auto Plasma System is used for the following processes among others:
 
- Photoresist stripping
- Surface cleaning after storage
- Surface cleaning after processes using oil pump or diffusion pump vacuum
- Surface cleaning as part of photolithography after wet developing
- Stripping of photoresist layers after etching
- Removal of organic passivating layers and masks
- Etching of glass and ceramic
- Etching of SiO2, Si3N4, Si
- Removal of polyimide layers.