2018 Finetech FINEPLACER pico ma multi purpose die bonder with 5um accuracy

Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.  

Placement accuracy 5 µm -

Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm -

Working area up to 450 mm x 234 mm -

Supports wafer/substrate sizes up to 200 mm -

Supports bonding forces up to 700 N -

includes tool heater with chip contact heating module-

WinFlipChip software version 3.2 Revision 052 and PC-

Manufacture Date 2018

Substrate heater available: Inquire