Sonix Echo VS Scanning Acoustic Microscope (2016) with 3 transducers
Sonix Echo VS Scanning Acoustic Microscope (2016) with 3 transducers
$129,500 (USD)
or
Call (408) 209-9278
Description
Sonix Echo VS
Acoustic scanning microscope enables the inspection of packaging.
Features:
To detect the smallest and most subtle defects in state-of-the-art packaged microelectronics applications
ECHO VS includes standard features such as heated water for optimal acoustic coupling
flexible TAMI for efficient acquisition of the most useful data
Waveform Averaging for improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for improved image quality in the most demanding applications.
ECHO VS is the ultimate ultrasonic NDT device for molded flip chips, CSP, MCM, stacked die
,MUF and other advanced packaging technologies.
Detects air defects as small as 0.01 microns and spatially resolves defects down to 5 microns.
Image enhancement suite with heated water, waveform simulation and other innovations
for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Wide range of converters from very low to ultra-high frequency
Molded Flip Chip Imaging (MFCI)
Voltage 100-120/220-240 VAC
1PH/N/PE, 50/60 Hz 10 A
Acoustic scanning microscope enables the inspection of packaging.
Features:
To detect the smallest and most subtle defects in state-of-the-art packaged microelectronics applications
ECHO VS includes standard features such as heated water for optimal acoustic coupling
flexible TAMI for efficient acquisition of the most useful data
Waveform Averaging for improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for improved image quality in the most demanding applications.
ECHO VS is the ultimate ultrasonic NDT device for molded flip chips, CSP, MCM, stacked die
,MUF and other advanced packaging technologies.
Detects air defects as small as 0.01 microns and spatially resolves defects down to 5 microns.
Image enhancement suite with heated water, waveform simulation and other innovations
for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Wide range of converters from very low to ultra-high frequency
Molded Flip Chip Imaging (MFCI)
Voltage 100-120/220-240 VAC
1PH/N/PE, 50/60 Hz 10 A
Specifications
| Stock Number | 4964 |
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