Temptronic-TPO3500 Titan thermal chuck controller

Temptronic-TPO3500 Titan thermal chuck controller

$2,900 (USD)

or
Call (408) 209-9278

Description

  • Patented TP03500 ThermoChuck design provides exceptional thermal and mechanical stability and precision.
  • Superior Temperature Uniformity:

    At temperatures to +200°C: ±0.5% or ±0.5°C, whichever is greater
    At temperatures = or > 200°C: ±1.0% of set temperature

  • Surface Flatness

    @ +200°C: <12.5 microns ( 200 mm ); <25 microns (300mm)
    @ +300°C: <25 microns

  • Surface to Base Parallelism: <20 microns @ +200°C
  • Surface Isolation: > 109 ohms standard; >1014 ohms available
  • Surface Capacitance at ambient:

    200 mm chuck: <750 pf standard, < 250 pf option available
    300 mm chuck: <800 pf standard, < 500 pf option available

  • Deflection:

    200 mm: <15 microns at 65 Kg 
    300 mm: <6 microns at 50 Kg

  • Low noise DC Control System keeps electrical noise to a minimum.
  • Modular System Design for convenient, cost-effective system upgrades as wafer diameter and temperature requirements change.
  • CE Approved, ETL listed for U.S.A. and Canada and Compliant with SEMI S2-93A standards.

    • Temperature Stability ±0.1°C

  • Precise temperature control and accuracy
  • Ramp/soak/cycle programming is controllable from front panel or via remote interface.
  • IEEE-488 and RS232 remote interface included.
  • Integrates with most major wafer probing stations, laser trimmers and inspection stations.
  • HCFC and CFC-free
  • Thermal cycling and steady-state thermal testing of wafers, hybrids and other flat devices at precise temperature
  • Ultra low noise test applications
  • High isolation for low leakage (femtoamp level), low capacitance test measurements; Co-axial and tri-axial configurations are available.
  • Ideal for high power and high probe load applications
  • Cold testing of wafers. Perform moisture-free cold probing with optional Controlled Environment Enclosure
  •  

    • The TP03500 System controller operates with the user's choice of:

    1) ThermoChuck Diameter
    2) ThermoChuck Surface
    3) High temperature capacity
    4) Low temperature capacity / cooling system
    5) Power Configuration

    TP03500 ThermoChuck System Configuration Table

    Model TP03500 Temperature Ranges
     

    200 mm

    300 mm

    Model TP03500A-65 / +200C-65 / +200C
    Model TP03500C+15 / +200C or +300C+15 / +200C or +300C
    Model TP03500D+20 / +200C or +300C or +400C+20 / +200C or +300C
    Model TP03500EAmbient (Ta) to +200C or +300CAmbient  (Ta) to +200C or +300C


    1) ThermoChuck Diameter:
    Choice of 200mm ( 8 inch) or 300mm ( 12 inches) to accommodate wafers up to 300mm in diameter. 

    2) ThermoChuck Surface:
      Choice of Gold-plated or nickel-plated surface is standard. (Other surface treatments are optional; contact Temptronic). 

    3) High Temperature Capacity:
      (See ThermoChuck System Configuration Table.)
      200 mm ThermoChuck: Choice of 200ºC, 300C or 400ºC
      300 mm ThermoChuck: Choice of 200ºC or 300ºC 

    4) Low Temperature Capacity
      Choice of Chiller: see TP03500 Configuration Table. 

    Show All

    Specifications

    Stock Number2306
    Sort0