Oxford Instruments Plasmalab 800 Plus PECVD with 460mm diameter electrode (2009)

Large Capacity Open Loaded Plasma Enhanced Chemical Vapor Deposition System.

460mm diameter electrode offers a capacity of up to twelve 4 in. wafers.

Ideally suited for batch PECVD processing where excellent across chamber uniformity of less than 2 percent is achieved for silicon nitride and silicon dioxide layers.

Configured for 2 in. wafers

18.75 in. top electrode with shower head gas input.

Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool,

mass flow controllers are housed separately in a wall mounted gas pod. Six MFC gas controllers, previously used gases He, N2, N2O, NH3, 5% SIH4/95% N2, 80% CF4- 20% O2

PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages.

Includes vacuum pump and blower package. Mfg. 2009

sn 94-219961

Original owner: Bridgelux, Fremont, CA

Software: PC2000 V1.8

Manufacture date 2009

Blower and pump package

208v/3 phase 18amps