Oxford Instruments Plasmalab 800 Plus PECVD with 460mm diameter electrode (2009)

Description

Large Capacity Open Loaded Plasma Enhanced Chemical Vapor Deposition System.

460mm diameter electrode offers a capacity of up to twelve 4 in. wafers.

Ideally suited for batch PECVD processing where excellent across chamber uniformity of less than 2 percent is achieved for silicon nitride and silicon dioxide layers.

Configured for 2 in. wafers

18.75 in. top electrode with shower head gas input.

Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool,

mass flow controllers are housed separately in a wall mounted gas pod. Six MFC gas controllers, previously used gases He, N2, N2O, NH3, 5% SIH4/95% N2, 80% CF4- 20% O2

PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages.

Includes vacuum pump and blower package. Mfg. 2009

sn 94-219961

Original owner: Bridgelux, Fremont, CA

Software: PC2000 V1.8

Manufacture date 2009

Blower and pump package

208v/3 phase 18amps

Plasma Enhanced Chemical Vapour Deposition (PECVD)

PECVD is a well established technique for deposition of a wide variety of films. Many types of device require PECVD to create high quality passivation or high density masks.

Highlights

Top electrode RF driven (MHz and/or kHz); no RF bias on lower (substrate) electrode

Substrate sits directly on heated electrode

Gas injected into process chamber via showerhead gas inlet in the top electrode

Film stress can be controlled by high/low frequency mixing techniques

Lower temperature processes compared to conventional CVD

Specifications

Stock Number	3700
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