2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
$68,500 (USD)
or
Call (408) 209-9278
Description
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
sn FD3.1 B172501
manufacture date 2017
Specifications
Stock Number | 4856 |
Sort | 0 |