2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

$68,500 (USD)

Description

Includes:

FINEPLACER lambda

Bonding force module FD3

Chip heating module

Optional Dispensing Module FG3

WinFlipChip software version 3.2 Revision 052 and PC

sn FD3.1  B172501

manufacture date 2017

Specifications

Stock Number4856
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