2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

$68,500 (USD)

Description

Includes:

FINEPLACER lambda

Bonding force module FD3

Chip heating module

Optional Dispensing Module FG3

WinFlipChip software version 3.2 Revision 052 and PC

Option: Substrate heater-add 12k

Specifications

Stock Number4856
ManufacturerFinetech
ModelLambda
Year2017
Serial NumberFD3.1 B172501
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