FINETECH PICO ma/rs Multi purpose bonder & High Density Rework station with motorized Z axis placement and 5um accuracy(2021)

Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. Finetech PICO configured for bonding optical lens assemblies used in LIDAR This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding , die attach and components requiring a novel bonding approach. Highlights - Placement accuracy 5 µm - Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm - Working area up to 450 mm x 234 mm - Motorized Z axis placement - Supports wafer/substrate sizes up to 200 mm - Supports bonding forces up to 700 N Manufacture date June 2021.  Original cost over 120k configuration: PICO base system with manual zoom camera and USB and LED illumination Integration of 2nd vaccum circuit Optics shifting 85mm, crank handled Target finder LED coaxial illumination for chip and substrate Placement arm including theta rotation Adjustment set, 5um for placement arm with fine rotation WinFlipChip software and PC Y-camera shifting Process video module Height adjustable tracks for positioning table Bonding force module, automatic UV curing option for FINEPLACER lambda, pico, micro Placement head with gimbal for chip 18.2x16.6x0.95 Eccentric tool holder Vacuum plate 220x120 with holder for tray and UV station Micron adjustable arm stop in lower arm position Full manual included sn P213069 Purchase order for PICO