2020 Allwin21/ Branson IPC AW-B3000 with 12"x23"d quartz barrel and Ebara EV-A10-2 dry pump

The AW-B3000 batch barrel plasma asher is a manual load RF plasma cleaning and photoresist strip system for semiconductor fabs, MEMS, packaging, national labs, and university nano fabs requiring production-proven dry cleaning capability with practical operation and low cost of ownership.

Barrel Plasma Technology Heritage

The AW-B3000 is based on a production-proven barrel plasma reactor architecture widely used for semiconductor photoresist strip, plasma cleaning, and general dry process applications in semiconductor manufacturing environments.In barrel plasma processing, RF plasma is generated inside the quartz reactor chamber while reactive species flow around the process region for batch plasma cleaning and photoresist removal. The barrel plasma reactor concept is especially suitable for thick photoresist stripping, general wafer cleaning, flexible substrate loading configurations, and longer plasma process applications where ultra-tight downstream plasma uniformity is not the primary requirement.

Production-Proven Barrel Plasma Platform

The AW-B3000 is designed for semiconductor fabs, MEMS, packaging, national labs, and university nano fabs that need a practical batch plasma asher for photoresist strip, dry cleaning, and long plasma cleaning processes.

Updated with air-cooled RF hardware, MFC gas delivery, Baratron pressure measurement, throttle valve pressure control, simplified maintenance access, and optional EOP function.

The modernized architecture helps reduce obsolete hardware dependency while improving serviceability, process flexibility, and long-term equipment support.

3. Flexible Batch Process Capability

The AW-B3000 supports small samples and wafers up to 8 inches depending on fixture and carrier configuration. Quartz boats, trays, and custom loading fixtures can be configured for different substrate shapes, sizes, and thicknesses.

This makes the system especially useful for R&D, MEMS, packaging, compound semiconductor support processes, and applications with different photoresist thicknesses or long ash times.

• Small sample to wafer batch processing
• Support for thick photoresist strip
• Flexible quartz boat and tray options
• Practical process development capability

Allwin21 AW software supports recipe editing, process curve display, process monitoring, diagnostics, calibration functions, subsystem testing, and optional EOP integration.

The software is designed to help process engineers and equipment engineers set up recipes, monitor process behavior, troubleshoot issues, and support long-term fab operation.

Quartz Reactor Size 12-inch diameter × 23-inch depth.

Substrate / Wafer Size Small samples to 8-inch round wafers.

Gas Lines 1–4 gas lines with MFCs.

Typical process gas is O₂. Additional gas configurations may be available depending on application requirements.

Typical MFC Configuration. 5 SLM O₂ or 500 SCCM O₂.

Base PressureTypically ~30–50 mTorr.

Typical process pressure around 3.0–4.5 Torr.

Standard reference processes commonly use approximately 3.75 Torr. Actual process pressure depends on recipe, gas flow, RF power, substrate condition, and application requirements.

Typical Ash Rate 0–0.2 µm/min typical, process dependent.

Actual ash rate depends on photoresist type, wafer temperature, RF power, chamber pressure, gas chemistry, loading condition, and process recipe.

Using a Faraday cage configuration can create a downstream-style plasma environment that helps reduce direct ion bombardment and plasma damage on sensitive substrates.

Selectivity >1000:1 typical, process dependent.

Actual selectivity depends on substrate material, photoresist chemistry, plasma condition, gas chemistry, RF power, pressure, and process recipe.

Standard Configuration

AW-B3000 Controller with Touchscreen Monitor and 1–4 gas lines with MFCs, integrated industrial PC, touchscreen GUI, control electronics, EMO, safety interlocks, breakers, relays, DC power distribution, and rear-panel interface connections to the reactor main body.

AW-B3000 main body includes cylindrical quartz reactor chamber, chamber door assembly, RF matching network, MKS Baratron pressure measurement, and throttle valve pressure control architecture.

RF Generator 600 W, 1000 W, or 1200 W air-cooled RF generator, 13.56 MHz.

One gas line with O₂ MFC (5 SLM or 500 SCCM typical), pneumatic valves, shut-off valve, and application-specific gas routing configuration integrated into the AW-B3000 controller.

MKS Baratron pressure measurement with throttle valve pressure control architecture integrated into the AW-B3000 controller.

Allwin21 proprietary process-engineer-oriented software with recipe control, real-time process monitoring, diagnostics, calibration functions, manual operation, subsystem testing, data logging, alarm history, maintenance support, and optional EOP integration.

Ebara Dry pump EV-A10-2