2018 Engis Japan EVG-300 Vertical lapping and grinding Machine for back-thinning wafers or substrates (SiC, Si, GaAs, GaN, and InP) up to 200mm

The Engis EVG-300 is a high-precision vertical grinding and lapping machine manufactured by the Engis Corporation Japan. It is designed for ultra-precision back-thinning, grinding, and polishing of hard, brittle materials like silicon carbide (SiC), sapphire, and ceramics used in the semiconductor and MEMS industries.

Key Specifications & Features

• Machine Dimensions: 1050 × 1050 × 2020 mm
• Grinding Spindle Motor: Typically 9 kW, 3-phase, 220V/60Hz
• Speed Capabilities: Worktable speed of up to 400 rpm; wheel speed of up to 2000 rpm
• Advanced Controls: Equipped with a Programmable Logic Controller (PLC) with available upgrades for automatic wheel dressing, automated positioning, and continuous in-process thickness measurement.
• Wheel Technology: Can utilize Engis' proprietary MAD (Mixed Abrasive Diamond) and Hy-Grind vitrified grinding wheels to achieve surface roughness below 1 nm Ra.

Ideal Applications

• Wafer grinding or back-thinning (SiC, Si, GaAs, GaN, and InP)
• Processing semiconductor components like ceramic chucks and glass ceramics
• Substrate machining for advanced packaging and MEMS

From Compund Semiconductor Magazine:

EVG Series offers wafer grinding or back-thinning for SiC, GaAs, Sapphire, Si, GaN, AIN, InP

Superabrasive specialist, Engis Corporation has announces the new EVG Series of high precision vertical grinding machines for the production of ultra smooth surfaces. These machines have been designed to grind advanced materials to a high degree of precision in flatness and surface quality, greatly reducing or even eliminating the need for subsequent lapping, moving direct from grinding to final polish of SiC and other materials.

Suitable applications for the EVG Series machines include semiconductor wafer grinding or back-thinning (SiC, GaAs, Sapphire, Si, GaN, AIN, InP), semiconductor equipment components, for example ceramic chucks, glass ceramic, as well as substrates for semiconductor advanced packaging, including MEMS (ceramic, polyimide).

Engis EVG machines are available in three different models, the EVG-200, EVG-250 and EVG-300, all of which incorporate a programmable logic controller, 400 rpm max. worktable speed and 2000 rpm max. wheel speed. Sizes of the machines vary from 800 x 800 x 1900 for the EVG-200 up to 1050 x 1050 x 2020 for the EVG-300. All machines have been designed with ergonomics in mind, with easy access to the work area and with a variety of chuck options.

Advanced machine control options are available, providing automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real time is also available.

The most advanced model offers automated thickness options: multi-point contact probing for multiple wafer grinding or a choice of contact or non-contact continuous in-process measurement for single wafer machining.

EVG Series machines are equipped with Engis grinding wheels based on the Mixed Abrasive Diamond (MAD) Wheel technology, which tailors the wheel to the material being processed. A video showing the machine at work is can be seen at www.engis.com/videos. Engis specialists application engineers can provide specific process recommendations for particular materials and applications.