Westbond 4KE Semiautomatic convertible wire bonder for standard wedge bonding, deep access wedge bonding and ball bonding

The West Bond 4KE is a semi-automatic wire bonder known for its 3-way convertible design, allowing it to be used for wedge, ball, or ribbon bonding. It features a gantry design with a motorized Z (vertical) and Y (forward/backward) axis for programmed wire loops, and a manually controlled X (side-to-side) axis. This system is ideal for high-power and high-frequency applications requiring precise, repeatable bond shapes and is popular in the microwave, semiconductor, and hybrid product industries.

Key Features and Capabilities

• 3-Way Convertible Design:
• Quickly switch between wedge, deep access wedge, ball, and ribbon bonding by exchanging the bond head, clamp assembly, and software mode. 
• Motorized Z and Y Axes:
• Microprocessor-controlled motors drive the Z and Y axes for precise, programmed control over the wire loop height and shape, maintaining consistency for multiple bonds. 
• Manual X Axis:
• A unique West•Bond micromanipulator allows for manual, precise positioning of the target location. 
• Gantry Design:
• The entire mechanism is positioned above the workplane, allowing for unlimited part size and shape accommodation for both small and large components. 
• Dual Force Mechanism:
• Provides two pre-set force values, allowing for either a high or low force to be programmed for any bond. 
• Radiant Tool Heat:
• The bond tool is heated with a panel-mounted radiant heater controlled by a constant current. 
• Integrated Vision System:
• A high-resolution camera with a crosshair generator provides an accurate view of the bonding area, allowing for precise target acquisition on an external monitor. 
• ESD Protection:
• The system includes conductive and dissipative features to protect against electrostatic discharge. 

Applications 

• High-Frequency and High-Power Devices:
• Excellent for applications where identical bond and loop shapes are critical, such as in microwave, semiconductor, and hybrid products.
• Large Substrates:
• The gantry design and throat-less chassis provide unlimited access to remote bonding targets on large packages and modules.

Bond Force: 10 – 150 grams;

Au / Al wire: Wedge 0.7 to 3 mil, Ribbon: 0.5x2mil to 1x10 mil, Au Ball Bonding: 0.7 to 2 mil.

115V, 50/60Hz, 3.2A