Marpet Enterprises MEI 1204B hybrid ball bonder
Marpet Enterprises MEI 1204B hybrid ball bonder
$7,500 (USD)
or
Call (408) 209-9278
Description
The MechEl / MEI 1204 is available in two configurations The MEI 1204B (Ball Bonder) and MEI 1204W (Wedge Bonder). Both the MEI 1204B and W will handle wire sizes from 0.0007†(17um) to 0.003†(75um) and are available with a full line of work holder and options to fit all applications.
SPECIFICATIONS:Â
| Bonding Processes: | Thermocompression or thermosonic ball bonding using gold wire. |
| Wire sizes: | 1 mil (25 micron) wire standard. Â 0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron) capability available. |
| Tip Weight: | 15 - 150 grams. |
| Capillary size: | 0.063" x 0.375" (1.6mm x 9.5 mm) standard. |
| Heated Workstage: | Digital heat control option will regulate temperature from ambient to 300°C +/- 0.5% (dependant upon application). |
| Ultrasonics: | Uthe 10G generator with 25ST transducer standard. |
| Micropositioner: | 6:1 standard. |
| Services: | Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. Air: 40 PSI (240 kPa) minimum, if required. Vacuum: 20" (510 mm) Hg minimum, if required. |
| Dimensions:Â Â | Length: 12.0" (30.5 cm) Width: 18.0" (45.7 cm) Height 17.75" (45.1cm) Net Weight: 50 pounds (23 Kg) |
*Note: Exact dimensions are dependent upon the options on the machine.
Specifications
| Stock Number | 2670 |
| Sort | 0 |