Royce Instruments DE35i-6 pick and place for wafers up to 150mm

Royce DE35i-6 semiautomatic pick and placeconfigured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packsminimum die size 0.008" squareOptem zoom microscope with coaxial fiber illuminator and power supplymonitor and crosshair generator