CEE Apogee 300 Bake Plate for maximum 12x12 substrates or 300mm round

• Compact design for minimized footprint

• Full-color, 7-inch touch screen display

• Enhanced logging • Cool touch exhausted hood

• Smart Pins for programmable height control

• Adjustable exhaust gate

• DataStream™ technology BAKE HOOD DESIGN

• All-stainless-steel construction

• Unique 2-layer design reduces exterior hood temperature

• Exhausted hood for removal of process chemicals

• Optional nitrogen purge for inert bake environment

PROGRAMMABILITY

• Touch screen interface and display

• Full-color alphanumeric-capable graphical user interface (GUI)

• Supports unlimited bake process programs/program steps per recipe

• 0.1-s resolution for step times with a range of 0 to 9,999.9-s/step

• Four automated bake methods: contact, vacuum, proximity, and lift pins

  Bake plate auto-sizing for 100mm, 150mm, 200mm, and 300mm wafers

• Temperature data recording 

   Smart Pins programmable in 0.1mm increments with an overall range of 0 to 19mm

• Up/download Datastream™ process parameters via native USB and Ethernet ports PRECISION

• Substrate sizes: up to 300mm round; 12 inches (304.8mm) square substrates

• Temperature resolution: 0.1°C

• Temperature range: ambient to 300°C (400°C optional)

• Temperature uniformity: ±0.3% across working surface

UTILITIES

• Voltage ranges: 208-230 VAC, 50/60Hz

• Power requirements: 3669W (16A) (max)

• Exhaust port: 2” (508mm) OD

• Vacuum: 20inHg (67.7Pa)

• Exhaust: 5 to 10cfm (141.6 - 283.2 liters/min)

• N2 (for bake plate proximity): 35psi (241.3Pa)