Suss Microtec HP8 Hot Plate for up to 200mm substrates

Dedicated Solution Designed for R&D, Laboratories and Small Scale Production

SUSS MicroTec's manual hot plate HP8 has been developed specifically to meet the requirements of R&D work and small scale production. The 200 mm hot plate (HP8) offers homogeneous temperature distribution as well as heating ramps with high repeating accuracy to ensure constant and stable process results.

Highlights

To aim for best in class temperature distribution SUSS HP8 doesn’t rely on conventional heating cartridges. Instead, several meters of heating coils are arranged within the base plate in a process proven pattern. This avoids hot or cool spots and ensures a uniform temperature distribution. The hot plate is specifically coated for increased mechanical and chemical resistance and easy cleaning.

The tool is configured for table top mounting and can be conveniently controlled through a dedicated touch screen controller. If combined with the coat and develop platform RCD8, the HP8 can be optionally controlled using the same touch screen PC as the RCD8. The table top and bench mount version fits the SUSS MicroTec LabSpin series nicely as well in size and look & feel.

Not only the form factor and control possibilities offer high flexibility, but the variety of available options such as lift pins, proximity bake and nitrogen purge perfectly adapt to the daily lab needs.

The closed double walled lid, ensures stable process conditions and prevents accidental touching of the hot surface by the operator.

HP8 TT Table top hot plate for wafer from Ø 2'' up to 200 mm or substrates up to 6'' x 6'' 

3 lifting pins for substrate handling 

Temperature range: 60 - 250 °C

Uniformity: +/-0.5 °C up to 120 °C, +/-1 % for 120 °C and above 

Including controller with touchpanel 

Max # recipes: 200 

Max # steps/recipe: 40 

Programmable temperature ramps: 0-10 °C/min (heating) 

Step time: 0 - 999 s in 1 s steps 

Tool size (inl. controller) 463 x 378 x 628 mm (l x w x h)