Micro Point Pro iBond 5000 Ball Bonder with heated workstage and Olympus stereozoom microscope

Micro Point Pro iBond 5000 Ball Bonder with heated workstage and Olympus stereozoom microscope

$24,450 (USD)

Description

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:

  • Optoelectronic modules
  • Hybrid/MCMs
  • Microwave products
  • Discrete devices/lasers
  • Semi-Automatic/Manual Mode with ‘Z’ Option

    ‘Z’ Axis DC Servo Motion with Closed-Loop Control

    Consistent Ball Size Via Negative Electronic Flame-Off

    Missing Ball Detection & Auto-Stop

    Deep Access Capability

    Built-In Temperature Controller

    Various Microscope and Spotlight Targeting Options Available

    Large 6” x 6” Bonding Area

    Variety of Wire Types: Gold & Copper (with copper kit option)

    Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

    Ball Bonding, Bumping, Coining, Security Bond & TabSEE DATASHEET LINK BELOW

    Specifications

    Stock Number5045
    ManufacturerMicro Point
    ModeliBond 5000
    Year2016
    Serial Number5000B-1131
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