Micro Point Pro iBond 5000 Ball Bonder with heated workstage and Olympus stereozoom microscope

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:

Semi-Automatic/Manual Mode with ‘Z’ Option

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Consistent Ball Size Via Negative Electronic Flame-Off

Missing Ball Detection & Auto-Stop

Deep Access Capability

Built-In Temperature Controller

Various Microscope and Spotlight Targeting Options Available

Large 6” x 6” Bonding Area

Variety of Wire Types: Gold & Copper (with copper kit option)

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Ball Bonding, Bumping, Coining, Security Bond & Tab

The system supports a range of wire sizes for different materials: 

• Gold wire: 17 to 75 microns (0.7 to 3.0 mils) in diameter for wedge bonding, or 17 to 70 microns for ball bonding.
• Aluminum wire: 20 to 75 microns (0.8 to 3.0 mils) in diameter for wedge bonding.
• Copper wire: 17 to 50 microns (0.7 to 2.0 mils) in diameter for ball bonding.
• Gold ribbon: Up to 25 x 250 microns (1 x 10 mils).